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Taiwan Semiconductor Manufacturing Company Limited

One of TSMC's factories in Taichung's Central Taiwan Science Park
Native name	台積電
Company type	Public
Traded as	TWSE: 2330 NYSE: TSM LSE: OLCV
ISIN	US8740391003
Industry	Semiconductors
Founded	21 February 1987; 37 years ago (1987-02-21), in Industrial Technology Research Institute, Hsinchu, Taiwan
Founder	Morris Chang
Headquarters	Hsinchu Science Park, Taiwan
Area served	Worldwide
Key people	Che Chia Wei (chairman and CEO)
Production output	12 million 12-inch equivalent wafers (2023)
Services	Manufacture of integrated circuits mask services integrated circuits packaging multi wafer foundry services
Revenue	US$69.30 billion (2023)
Operating income	US$26.88 billion (2023)
Net income	US$30.09 billion (2023)
Total assets	US$169.6 billion (2023)
Total equity	US$112.7 billion (2023)
Number of employees	76,478 (2023)
Divisions	SSMC (38.8% joint venture with NXP)
Subsidiaries	WaferTech TSMC Nanjing Company Ltd. JASM
Chinese name
Traditional Chinese	台灣積體電路製造股份有限公司
Transcriptions Standard Mandarin Hanyu Pinyin Táiwān Jītǐ Diànlù Zhìzào Gǔfèn Yǒuxiàn Gōngsī Bopomofo ㄊㄞˊ ㄨㄢ ㄐㄧ ㄊㄧˇ ㄉㄧㄢˋ ㄌㄨˋ ㄓˋ ㄗㄠˋ ㄍㄨˇ ㄈㄣˋ ㄧㄡˇ ㄒㄧㄢˋ ㄍㄨㄥ ㄙ Wade–Giles T'ai-wan Chi-t'i Tien-lu Chih-tsao Ku-fen You-hsien Kung-ssŭ Southern Min Hokkien POJ Tâi-oân chek-thé tiān-lō͘ chè-chō kó͘-hūn iú-hān kong-si Tâi-lô Tâi-uân tsik-thé tiān-lōo tsè-tsō kóo-hūn iú-hān kong-si
Abbreviation
Traditional Chinese	台積電
Transcriptions Standard Mandarin Hanyu Pinyin Tái Jī Diàn Wade–Giles T'ai Chi Tien Southern Min Hokkien POJ Tâi-chek-tiān Tâi-lô Tâi-tsik-tiān
Website	tsmc.com
Footnotes / references

Taiwan Semiconductor Manufacturing Company Limited (TSMC or Taiwan Semiconductor) is a Taiwanese multinational semiconductor contract manufacturing and design company. It is the world's most valuable semiconductor company, the world's largest dedicated independent ("pure-play") semiconductor foundry, and Taiwan's largest company, with headquarters and main operations located in the Hsinchu Science Park in Hsinchu, Taiwan. Although the central government of Taiwan is the largest individual shareholder, the majority of TSMC is owned by foreign investors. In 2023, the company was ranked 44th in the Forbes Global 2000. Taiwan's exports of integrated circuits amounted to $184 billion in 2022, accounted for nearly 25 percent of Taiwan's GDP. TSMC constitutes about 30 percent of the Taiwan Stock Exchange's main index.

TSMC was founded in Taiwan in 1987 by Morris Chang as the world's first dedicated semiconductor foundry. It has long been the leading company in its field. When Chang retired in 2018, after 31 years of TSMC leadership, Mark Liu became chairman and C. C. Wei became Chief Executive. It has been listed on the Taiwan Stock Exchange since 1993; in 1997 it became the first Taiwanese company to be listed on the New York Stock Exchange. Since 1994, TSMC has had a compound annual growth rate (CAGR) of 17.4% in revenue and a CAGR of 16.1% in earnings.

Most fabless semiconductor companies such as AMD, Apple, ARM, Broadcom, Marvell, MediaTek, Qualcomm, and Nvidia are customers of TSMC, as are emerging companies such as Allwinner Technology, HiSilicon, Spectra7, and UNISOC. Programmable logic device companies Xilinx and previously Altera also make or made use of TSMC's foundry services. Some integrated device manufacturers that have their own fabrication facilities, such as Intel, NXP, STMicroelectronics, and Texas Instruments, outsource some of their production to TSMC. At least one semiconductor company, LSI, re-sells TSMC wafers through its ASIC design services and design IP portfolio.

TSMC has a global capacity of about thirteen million 300 mm-equivalent wafers per year as of 2020 and produces chips for customers with process nodes from 2 microns to 3 nanometres. TSMC was the first foundry to market 7-nanometre and 5-nanometre (used by the 2020 Apple A14 and M1 SoCs, the MediaTek Dimensity 8100, and AMD Ryzen 7000 series processors) production capabilities, and the first to commercialize ASML's extreme ultraviolet (EUV) lithography technology in high volume.

History

In 1986, Li Kwoh-ting, representing the Executive Yuan, invited Morris Chang to serve as the president of the Industrial Technology Research Institute (ITRI) and offered him a blank check to build Taiwan's chip industry. At that time, the Taiwanese government wanted to develop its semiconductor industry, but its high investment and high risk nature made it difficult to find investors. Texas Instruments and Intel turned down Chang. Only Philips was willing to sign a joint venture contract with Taiwan to put up $58 million, transfer its production technology, and license intellectual property in exchange for a 27.5 percent stake in TSMC. Alongside generous tax benefits, the Taiwanese government, through the National Development Fund, Executive Yuan, provided another 48 percent of the startup capital for TSMC, and the rest of the capital was raised from several of the island's wealthiest families, who owned firms that specialized in plastics, textiles, and chemicals. These wealthy Taiwanese were directly "asked" by the government to invest. "What generally happened was that one of the ministers in the government would call a businessman in Taiwan," Chang explained, "to get him to invest." From day one, TSMC was not really a private business: it was a project of the Taiwanese state. Its first CEO was James E. Dykes, who left after a year and Morris Chang became the CEO.

Since then, the company has continued to grow, albeit subject to the cycles of demand. In 2011, the company planned to increase research and development expenditures by almost 39% to NT$50 billion to fend off growing competition. The company also planned to expand capacity by 30% in 2011 to meet strong market demand. In May 2014, TSMC's board of directors approved capital appropriations of US$568 million to increase and improve manufacturing capabilities after the company forecast higher than expected demand. In August 2014, TSMC's board of directors approved additional capital appropriations of US$3.05 billion.

In 2011, it was reported that TSMC had begun trial production of the A5 SoC and A6 SoCs for Apple's iPad and iPhone devices. According to reports, in May 2014 Apple sourced its A8 and A8X SoCs from TSMC. Apple then sourced the A9 SoC with both TSMC and Samsung (to increase volume for iPhone 6S launch) and the A9X exclusively with TSMC, thus resolving the issue of sourcing a chip in two different microarchitecture sizes. As of 2014, Apple was TSMC's most important customer. In October 2014, ARM and TSMC announced a new multi-year agreement for the development of ARM based 10 nm FinFET processors.

Over the objection of the Tsai Ing-wen administration, in March 2017, TSMC invested US$3 billion in Nanjing to develop a manufacturing subsidiary there.

In 2020, TSMC became the first semiconductor company in the world to sign up for the RE100 initiative, pledging to use 100% renewable energy by 2050. TSMC accounts for roughly 5% of the energy consumption in Taiwan, even exceeding that of the capital city Taipei. This initiative was thus expected to accelerate the transformation to renewable energy in the country. For 2020, TSMC had a net income of US$17.60 billion on a consolidated revenue of US$45.51 billion, an increase of 57.5% and 31.4% respectively from the 2019 level of US$11.18 billion net income and US$34.63 billion consolidated revenue. Its market capitalization was over $550 billion in April 2021. TSMC's revenue in the first quarter of 2020 reached US$10 billion, while its market capitalization was US$254 billion. TSMC's market capitalization reached a value of NT$1.9 trillion (US$63.4 billion) in December 2010. It was ranked 70th in the FT Global 500 2013 list of the world's most highly valued companies with a capitalization of US$86.7 billion, while reaching US$110 billion in May 2014. In March 2017, TSMC's market capitalization surpassed that of semiconductor giant Intel for the first time, hitting NT$5.14 trillion (US$168.4 billion), with Intel's at US$165.7 billion. On 27 June 2020, TSMC briefly became the world's 10th most valuable company, with a market capitalization of US$410 billion.

To mitigate business risks in the event of war between Taiwan and the People's Republic of China, since the beginning of the 2020s, TSMC has expanded its geographic operations, opening new fabs in Japan and the United States, with further plans for expansion into Germany. In July 2020, TSMC confirmed it would halt the shipment of silicon wafers to Chinese telecommunications equipment manufacturer Huawei and its subsidiary HiSilicon by 14 September. In November 2020, officials in Phoenix, Arizona in the United States approved TSMC's plan to build a $12 billion chip plant in the city. The decision to locate a plant in the US came after the Trump administration warned about the issues concerning the world's electronics made outside of the U.S. In 2021, news reports claimed that the facility might be tripled to roughly a $35 billion investment with six factories. See TSMC § Arizona for more details.

In June 2021, following nearly a year of public controversy surrounding its COVID-19 vaccine shortage, with only about 10% of its 23.5 million population vaccinated; Taiwan agreed to allow TSMC and Foxconn to jointly negotiate purchasing COVID-19 vaccines on its behalf. In July 2021, BioNTech's Chinese sales agent Fosun Pharma announced that the two technology manufacturers had reached an agreement to purchase 10 million BioNTech COVID-19 vaccines from Germany. TSMC and Foxconn pledged to each buy five million doses for up to $175 million, for donation to Taiwan's vaccination program.

Due to the 2020–2023 global semiconductor shortage, Taiwanese competitor United Microelectronics raised prices approximately 7–9 percent, and prices for TSMC's more mature processors will be raised by about 20 percent. In November 2021, TSMC and Sony announced that TSMC would be establishing a new subsidiary named Japan Advanced Semiconductor Manufacturing [ja; zh] (JASM) in Kumamoto, Japan. The new subsidiary will manufacture 22- and 28-nanometer processes. The initial investment will be approximately $7 billion, with Sony investing approximately $500 million for a less than 20% stake. Construction of the fabrication plant is expected to start in 2022, with production targeted to begin two years later in 2024.

In February 2022, TSMC, Sony Semiconductor Solutions, and Denso announced that Denso would take a more than 10% equity stake in JASM with a US$0.35 billion investment, amid a scarcity of chips for automobiles. TSMC will also enhance JASM's capabilities with 12/16 nanometer FinFET process technology in addition to the previously announced 22/28 nanometer process and increase monthly production capacity from 45,000 to 55,000 12-inch wafers. The total capital expenditure for JASM's Kumamoto fab is estimated to be approximately US$8.6 billion. The Japanese government wants JASM to supply essential chips to Japan's electronic device makers and auto companies as trade friction between the United States and China threatens to disrupt supply chains. The fab is expected to directly create about 1,700 high-tech professional jobs.

In July 2022, TSMC announced the company had posted a record profit in the second quarter, with net income up 76.4 percent year-over-year. The company saw steady growth in the automotive and data center sectors with some weakness in the consumer market. Some of the capital expenditures are projected to be pushed up to 2023. In the third quarter of 2022, Berkshire Hathaway disclosed purchase of 60 million shares in TSMC, acquiring a $4.1 billion stake, making it one of its largest holdings in a technology company. However, Berkshire sold off 86.2% of its stake by the next quarter citing geopolitical tensions as a factor. In February 2024, TSMC shares hit a record high, with the high on the trading day reaching NT$709 and closing at NT$697 (+8%). This was influenced by the increase in the price target on chip designer Nvidia. TSMC currently manufactures 3-nanometer chips and plans to start 2-nanometer mass production in 2025. It is included in the FTSE4Good Index, being the only Asian company in the top ten.

In October 2024, TSMC informed the United States Department of Commerce about a potential breach of export controls in which one of its most advanced chips was sent to Huawei via another company with ties to the Chinese government.

Patent dispute with GlobalFoundries

On 26 August 2019, GlobalFoundries filed several patent infringement lawsuits against TSMC in the US and Germany claiming that TSMC's 7 nm, 10 nm, 12 nm, 16 nm, and 28 nm nodes infringed 16 of their patents. GlobalFoundries named twenty defendants. TSMC said that they were confident that the allegations were baseless. On 1 October 2019, TSMC filed patent infringement lawsuits against GlobalFoundries in the US, Germany and Singapore, claiming that GlobalFoundries' 12 nm, 14 nm, 22 nm, 28 nm and 40 nm nodes infringed 25 of their patents. On 29 October 2019, TSMC and GlobalFoundries announced a resolution to the dispute, agreeing to a life-of-patents cross-license for all of their existing semiconductor patents and new patents for the next 10 years.

Corporate affairs

Senior leadership

• Chairman: C. C. Wei (since June 2024)
• Chief Executive: C. C. Wei (since June 2018)

List of former chairmen

1. Morris Chang (1987–2018)
2. Mark Liu (2018–2024)

List of former chief executives

1. Morris Chang (1987–2005)
2. Rick Tsai (2005–2009)
3. Morris Chang (2009–2013); second term
4. C. C. Wei and Mark Liu (2013–2018); co-CEO's

Business trends

The key trends for TSMC are (as of the financial year ending December 31):

TSMC and the rest of the foundry industry are exposed to the cyclical industrial dynamics of the semiconductor industry. TSMC must ensure its production capacity to meet strong customer demand during upturns; however, during downturns, it must contend with excess capacity because of weak demand and the high fixed costs associated with its manufacturing facilities. As a result, the company's financial results tend to fluctuate with a cycle time of a few years. This is more apparent in earnings than revenues because of the general trend of revenue and capacity growth. TSMC's business has generally also been seasonal, with a peak in Q3 and a low in Q1.

In 2014, TSMC was at the forefront of the foundry industry for high-performance, low-power applications, leading major smartphone chip companies, such as Qualcomm, Mediatek, and Apple, to place an increasing amount of orders. While the competitors in the foundry industry (primarily GlobalFoundries and United Microelectronics Corporation) have encountered difficulties ramping leading-edge 28 nm capacity, the leading Integrated Device Manufacturers such as Samsung and Intel that seek to offer foundry capacity to third parties were also unable to match the requirements for advanced mobile applications.

For most of 2014, TSMC saw a continuing increase in revenues due to increased demand, primarily due to chips for smartphone applications. TSMC raised its financial guidance in March 2014 and posted 'unseasonably strong' first-quarter results. For Q2 2014, revenues came in at NT$183 billion, with 28 nm technology business growing more than 30% from the previous quarter. Lead times for chip orders at TSMC increased due to a tight capacity situation, putting fabless chip companies at risk of not meeting their sales expectations or shipment schedules, and in August 2014 it was reported that TSMC's production capacity for the fourth quarter of 2014 was already almost fully booked, a scenario that had not occurred for many years, which was described as being due to a ripple-effect due to TSMC landing CPU orders from Apple.

However, monthly sales for 2014 peaked in October, decreasing by 10% in November due to cautious inventory adjustment actions taken by some of its customers. TSMC's revenue for 2014 saw growth of 28% over the previous year, while TSMC forecasted that revenue for 2015 would grow by 15 to 20 percent from 2014, thanks to strong demand for its 20 nm process, new 16 nm FinFET process technology as well as continuing demand for 28 nm, and demand for less advanced chip fabrication in its 200mm fabs.

Ownership

Around 56% of TSMC shares are held by the general public and around 38% are held by institutions. The largest shareholders in early 2024 were:

• National Development Fund, Executive Yuan (6.38%)
• BlackRock (5.09%)
• Capital Research and Management Company (3.61%)
• Government of Singapore Investment Corporation (3.32%)
• Norges Bank (1.59%)
• Fidelity Investments (1.37%)
• New Labor Pension Scheme (1.28%)
• The Vanguard Group (1.26%)
• Yuanta Securities Investment (1.02%)
• JPMorgan Chase (0.83%)
• Fidelity International (0.8%)
• Baillie Gifford (0.76%)
• Fubon Life Insurance (0.75%)
• Invesco (0.63%)

Technologies

TSMC's N7+ is the first commercially available extreme-ultraviolet lithographic process in the semiconductor industry. It uses ultraviolet patterning and enables more acute circuits to be implemented on the silicon. N7+ offers a 15–20% higher transistor density and 10% reduction in power consumption than previous technology. The N7 achieved the fastest ever volume time to market, faster than 10 nm and 16 nm. The N5 iteration doubles transistor density and improves performance by an additional 15%.

Production capabilities

On 300 mm wafers, TSMC has silicon lithography on node sizes:

• 0.13 μm (130 nm, options: general-purpose (G), low-power (LP), high-performance low-voltage (LV))
• 90 nm (based upon 80GC from Q4/2006)
• 65 nm (options: general-purpose (GP), low-power (LP), ultra-low power (ULP, LPG)
• 55 nm (options: general-purpose (GP), low-power (LP)
• 40 nm (options: general-purpose (GP), low-power (LP), ultra-low power (ULP)
• 28 nm (options: high-performance (HP), high-performance mobile (HPM), high-performance computing (HPC), high-performance low-power (HPL), low-power (LP), high-performance computing Plus (HPC+), ultra-low power (ULP) with HKMG
• 22 nm (options: ultra-low power (ULP), ultra-low leakage (ULL)
• 20 nm
• 16 nm (options: FinFET (FF), FinFET Plus (FF+), FinFET Compact (FFC)
• 12 nm (options: FinFET Compact (FFC), FinFET Nvidia (FFN)), enhanced version of 16 nm process
• 10 nm (options: FinFET (FF)
• 7 nm (options: FinFET (FF), FinFET Plus (FF+), FinFET Pro (FFP), high-performance computing (HPC)
• 6 nm (options: FinFET (FF), risk production started in Q1 2020, enhanced version of 7 nm process
• 5 nm (options: FinFET (FF)
• 4 nm (options: FinFET (FF), risk production started in 2021, enhanced version of 5 nm process
• 3 nm (options: FinFET (FF), volume production started in Q4 2022

It also offers "design for manufacturing" (DFM) customer services. In press publications, these processes will often be referenced, for example, for the mobile variant, simply by 7nmFinFET or even more briefly by 7FF. At the beginning of 2019, TSMC was advertising N7+, N7, and N6 as its leading edge technologies. As of June 2020, TSMC is the manufacturer selected for production of Apple's 5 nanometer ARM processors, as "the company plans to eventually transition the entire Mac lineup to its Arm-based processors, including the priciest desktop computers". In July 2020, TSMC signed a 20-year deal with Ørsted to buy the entire production of two offshore wind farms under development off Taiwan's west coast. At the time of its signing, it was the world's largest corporate green energy order ever made. In July 2021, both Apple and Intel were reported to be testing their proprietary chip designs with TSMC's 3 nm production.

Facilities

Arizona

In 2020, TSMC announced a planned fab in Phoenix, Arizona, intended to begin production by 2024 at a rate of 20,000 wafers per month. As of 2020, TSMC announced that it would bring its newest 5 nm process to the Arizona facility, a significant break from its prior practice of limiting US fabs to older technologies. The Arizona plant was estimated to not be fully operational until 2024, when the 5 nm process is projected to be replaced by TSMC's 3 nm process as the latest technology. At launch it will be the most advanced fab in the United States. TSMC plans to spend $12 billion on the project over eight years, beginning in 2021. TSMC claimed the plant will create 1,900 full-time jobs.

In December 2022, TSMC announced its plans to triple its investment in the Arizona plants in response to the growing tensions between the US and China and the supply chain disruption that has led to chip shortages. In that same month, TSMC stated that they were running into major cost issues, because the cost of construction of buildings and facilities in the US is four to five times what an identical plant would cost in Taiwan, (due to higher costs of labor, red tape, and training), as well as difficulty finding qualified personnel (for which it has hired US workers and sent them for training in Taiwan for 12–18 months.) These additional production costs will increase the cost of TSMC's chips made in the US to at least 50% more than the cost of chips made in Taiwan. In July 2023 TSMC warned that US talent was insufficient, so Taiwanese workers will need to be brought in for a limited time, and that the chip factory won't be operational until 2025. In September 2023, an analyst said the chips will still need to be sent back to Taiwan for packaging. In January 2024, TSMC chairman Liu again warned that Arizona lacked workers with the specialized skills to hire and that TSMC's second Arizona plant likely won't start volume production of advanced chips until 2027 or 2028.

In April 2024, the US Commerce Department agreed to provide $6.6 billion in direct funding and up to $5 billion in loans to TSMC for the purposes of creating semiconductor manufacturing facilities in Arizona. This action falls under the CHIPS and Science Act and is intended to boost domestic chip production for the USA.

Central Taiwan Science Park

The investment of US$9.4 billion to build its third 300mm wafer fabrication facility in Central Taiwan Science Park (Fab 15) was originally announced in 2010. The facility was expected to manufacture over 100,000 wafers a month and generate US$5 billion per year of revenue. TSMC has continued to expand advanced 28 nm manufacturing capacity at Fab 15. On 12 January 2011, TSMC announced the acquisition of land from Powerchip Semiconductor for NT$2.9 billion (US$96 million) to build two additional 300mm fabs (Fab 12B) to cope with increasing global demand.

WaferTech subsidiary

WaferTech, a subsidiary of TSMC, is a pure-play semiconductor foundry based in Camas, Washington, 32 km (20 mi) outside Portland, Oregon. The WaferTech campus contains a 9.3 ha (23 acres) complex housed on 105 ha (260 acres), with a main fabrication facility consisting of a 12,000 m (130,000 sq ft) 200mm wafer fabrication plant. The site is the second-largest pure-play foundry in the United States, employing 1,100 workers. The largest is GlobalFoundries Fab 8 in Malta, New York, which employs over 3,000 workers with over 278,709 m (3,000,000 sq ft) under one roof. As of 2024, the facility supports node sizes of 0.35, 0.30, 0.25, 0.22, 0.18, and 0.16 micrometers, with an emphasis on embedded flash process technology.

History

WaferTech was established in June 1996 as a joint venture with TSMC, Altera, Analog Devices, and ISSI as key partners. The four companies and minor individual investors placed US$1.2 billion into this venture, which was at the time the single largest startup investment in the state of Washington. The company started production in July 1998 in its 200mm semiconductor fabrication plant. Its first product was a 0.35 micrometer part for Altera. TSMC bought out the joint venture partners in 2000 and acquired full control, operating it as a fully owned subsidiary. In 2015, Tsung Kuo was named company president and fab director of WaferTech.

Japan

In November 2021, TSMC and Sony announced that TSMC would be establishing a new subsidiary named Japan Advanced Semiconductor Manufacturing [ja; zh] (JASM) in Kumamoto, Japan. The new subsidiary will manufacture 22- and 28-nanometer processes. The initial investment will be approximately $7 billion, with Sony investing approximately $500 million for a less than 20% stake. Construction of the fabrication plant is expected to start in 2022, with production targeted to begin two years later in 2024.

Germany

In August 2023, TSMC committed €3.5 billion to a €10+ billion factory in Dresden, Germany. The plant is subsidised with €5 billion from the German government. Three European companies (Robert Bosch GmbH, Infineon Technologies, and NXP Semiconductors) invested in the plant in return for a 10% share each. The resulting joint venture with TSMC is named European Semiconductor Manufacturing Company (ESMC). The factory is planned to be fully operational in 2029 with a monthly capacity of 40,000 12-inch wafers.

See also

• List of companies of Taiwan
• List of semiconductor fabrication plants
• Moore's law
• Quantum tunnelling
• Semiconductor device fabrication
• Semiconductor industry in Taiwan
• Very Large Scale Integration

References

1. "TSMC Shareholders Elect Board of Directors; Board of Directors Unanimously Elects Dr. C.C. Wei as Chairman and CEO". TSMC. 4 June 2024. Archived from the original on 7 June 2024. Retrieved 7 June 2024.
2. "Taiwan Semiconductor Manufacturing Company". TSMC. Archived from the original on 6 November 2017. Retrieved 19 May 2014.
3. "TSMC Ltd 2023 Annual Report (Form 20-F)". SEC.gov. U.S. Securities and Exchange Commission. 18 April 2024. Archived from the original on 26 October 2024. Retrieved 27 October 2024.
4. Zacks Equity Research (13 April 2021). "What's in Store for Taiwan Semiconductor's (TSM) Q1 Earnings?". Yahoo! Finance. Archived from the original on 14 October 2022. Retrieved 17 April 2021.
5. The Value Portfolio (16 April 2021). "Taiwan Semiconductor Stock: Great Company, But Valuation Too High (NYSE:TSM)". SeekingAlpha. Archived from the original on 16 December 2021. Retrieved 17 April 2021.
6. Chiang, Sheila (20 July 2023). "TSMC reports first profit drop in 4 years as electronics demand slump continues". CNBC. Archived from the original on 12 November 2023. Retrieved 22 October 2023.
7. "Advanced Technology Key to Strong Foundry Revenue per Wafer". IC Insights. 12 October 2018. Archived from the original on 14 July 2019. Retrieved 14 July 2019.
8. "Taiwan chipmaker TSMC's earnings soar 91%, Companies & Markets News & Top Stories". The Straits Times. Bloomberg. 17 April 2020. Archived from the original on 2 May 2020. Retrieved 4 May 2020.
9. Strong, Matthew (24 March 2020). "Taiwan chip giant TSMC wants 30,000 employees to work from home". Taiwan News. Archived from the original on 2 May 2020. Retrieved 4 May 2020.
10. "Taiwan Semiconductor Manufacturing Company Limited (2330)". Nikkei Asia. Archived from the original on 13 May 2023. Retrieved 14 May 2023.
11. "TSMC becomes safe haven for foreign investors; market cap hits high". Taiwan News. Central News Agency. 17 March 2016. Archived from the original on 26 March 2022. Retrieved 17 April 2021.
12. "The Global 2000 2023". Forbes. Archived from the original on 29 January 2024. Retrieved 7 February 2024.
13. Yang, Charlotte (14 February 2024). "Taiwan Stock Index Climbs to Record High on Optimism Over AI – BNN Bloomberg". BNNBloomberg. Bloomberg. Archived from the original on 31 March 2024. Retrieved 31 March 2024.
14. "Taiwan's economic outlook: a challenging year as global semiconductor sales slump". Think.ing. 25 April 2023. Archived from the original on 7 February 2024. Retrieved 31 March 2024.
15. "Company Info". TSMC. Archived from the original on 6 November 2017. Retrieved 20 December 2010.
16. "D&R Foundry Corner – TSMC". Design & Reuse. Archived from the original on 22 May 2014. Retrieved 18 May 2014.
17. Jennings, Ralph. "How Taiwan Chipmaker TSMC Will Prosper For 5 More Years Without Its Iconic Founder". Forbes. Archived from the original on 9 July 2020. Retrieved 9 July 2020.
18. Horwitz, Josh (5 June 2018). "After spawning a $100 billion industry, Taiwan's "godfather" of computer chips is retiring". Quartz. Archived from the original on 10 July 2020. Retrieved 9 July 2020.
19. 11 March, Tim Phillips |; TSM, 2020 | More on (11 March 2020). "Forget China Mobile. Buy This Stock to Play the 5G and AI Supercycle". The Motley Fool Hong Kong (in Simplified Chinese). Archived from the original on 5 August 2020. Retrieved 9 July 2020.{{cite web}}: CS1 maint: numeric names: authors list (link)
20. Abrams, Randy (25 November 2013), Asia Semiconductor Sector (Sector Review), Asia Pacific Equity Research, Credit Suisse, pp. 1, 3
21. Nenni, Daniel (25 April 2013). "Morris Chang on Altera and Intel". SemiWiki. Archived from the original on 29 August 2018. Retrieved 23 May 2014.
22. "Intel Outsourcing Some Atom Manufacturing to TSMC". The Oregonian. 2 March 2009. Archived from the original on 23 December 2017. Retrieved 15 October 2010.
23. Loukil, Ridha (9 October 2017). "STMicroelectronics envisage la création de deux usines de puces avec l'aide des Etats français et italien". Ousine Nouvelle (in French). Archived from the original on 14 September 2018. Retrieved 2 February 2018.
24. Miller, Chris (2022). Chip War: The Fight for the World's Most Critical Technology. Scribner. p. 167. ISBN 978-1982172008. Retrieved 16 July 2023.
25. "猶太人與台積電的奇特淵源". www.upmedia.mg (in Chinese (Taiwan)). 上報. 16 February 2021. Archived from the original on 30 January 2023. Retrieved 30 January 2023.
26. "與飛利浦數度交手" (in Chinese (Taiwan)). CommonWealth Magazine. 1 April 1997. Archived from the original on 14 March 2023. Retrieved 30 January 2023.
27. Nenni, Daniel (26 November 2023). "Taiwan Semiconductor Outlook May 1988". Semiwiki. Archived from the original on 25 November 2023. Retrieved 25 November 2023.
28. Wang, Lisa (21 December 2010). "TSMC plans to increase research spending". Taipei Times. Archived from the original on 24 March 2019. Retrieved 20 December 2010.
29. "TSMC to expand capacity by 30% in 2011". China Knowledge. 8 December 2010. Archived from the original on 8 July 2011. Retrieved 20 December 2010.
30. ^ "TSMC forecasts 22 percent Q2 growth". Taipei Times. 18 April 2014. Archived from the original on 22 May 2014. Retrieved 18 May 2014.
31. "TSMC Board of Directors Meeting Resolutions". TSMC. 12 August 2014. Archived from the original on 16 December 2021. Retrieved 17 April 2021.
32. "TSMC Kicks Off A6 Processor Trial Production with Apple". Chinese Economic News Service. 12 August 2011. Archived from the original on 27 September 2011. Retrieved 13 September 2011.
33. Velazco, Chris (12 August 2011). "TSMC Beginning Production Of Apple's New A6 Processor". TechCrunch. Archived from the original on 23 September 2017. Retrieved 25 June 2017.
34. Oliver, Sam (10 July 2014). "Apple begins receiving shipments of A-series processors from TSMC – report". AppleInsider. Archived from the original on 2 November 2014. Retrieved 2 November 2014.
35. ^ "TSMC to Snatch All of Apple's A8 chip Orders?". TechNews. 17 February 2014. Archived from the original on 24 March 2019. Retrieved 18 May 2014.
36. ^ Crothers, Brooke (17 April 2014). "Apple driving move to 64-bit mobile processors, TSMC says". CNET. Archived from the original on 21 May 2014. Retrieved 23 May 2014.
37. ^ "Apple chips to be 20% of TSMC sales". Taipei Times. 15 April 2014. Archived from the original on 22 December 2017. Retrieved 18 May 2014.
38. Collins, Mark (8 October 2014). "ARM Partnered With TSMC For 10nm FinFET Processors". GSM Insider. Archived from the original on 13 October 2014.
39. Xin, Qiang (2024). "Selective Engagement: Mainland China's Dual-Track Taiwan Policy". In Zhao, Suisheng (ed.). The Taiwan Question in Xi Jinping's Era: Beijing's Evolving Taiwan Policy and Taiwan's Internal and External Dynamics. London and New York: Routledge. ISBN 9781032861661.
40. "TSMC Leads Rush for Renewables Ahead of Taiwan Energy Vote". Bloomberg.com. 8 December 2021. Archived from the original on 7 February 2022. Retrieved 19 December 2021.
41. "TSMC's push toward green energy – Taipei Times". www.taipeitimes.com. 17 July 2020. Archived from the original on 19 December 2021. Retrieved 19 December 2021.
42. "Annual Reports". TSMC. Archived from the original on 20 April 2021. Retrieved 1 May 2021.
43. Lee, Yimou (16 April 2020). "TSMC Q1 profit almost doubles but trims full-year revenue estimate on pandemic". U.S. Archived from the original on 17 May 2020. Retrieved 15 May 2020.
44. ^ "Taiwan Semiconductor Manufacturer (TSM) Stock Price, Quote, History & News – Yahoo Finance". Finance.yahoo.com. Archived from the original on 28 May 2020. Retrieved 15 May 2020.
45. "Market capitalization of TSMC reaches a historic high: CEO". AsiaOne Business. 21 December 2010. Archived from the original on 28 July 2011. Retrieved 20 December 2010.
46. "FT 500 2013". Financial Times. Archived from the original on 10 December 2022. Retrieved 18 May 2014.
47. Culpan, Tim (22 March 2017). "Chipzilla Got Toppled". Bloomberg Gadfly. Archived from the original on 22 March 2017. Retrieved 22 March 2017.
48. Wu, Debby (28 July 2020). "TSMC Pares Gains After $72 Billion Surge to Start the Week". Bloomberg. Archived from the original on 17 April 2021. Retrieved 17 April 2021.
49. "China War Risk Sees Taiwan's TSMC Moving Fabs to US, Japan". Asia Financial. 21 February 2022. Archived from the original on 19 May 2022. Retrieved 27 May 2022.
50. "TSMC plans to halt chip supplies to Huawei in 2 months". Nikkei Asian Review. Archived from the original on 8 August 2020. Retrieved 9 August 2020.
51. Frumusanu, Andrei. "TSMC Confirms Halt to Huawei Shipments In September". www.anandtech.com. Archived from the original on 8 August 2020. Retrieved 9 August 2020.
52. Wu, Debby; King, Ian (19 November 2020). "TSMC Wins Approval From Phoenix for $12 Billion Chip Plant". Bloomberg. Archived from the original on 27 February 2021. Retrieved 2 March 2021.
53. Vanek, Corina (2 March 2021). "Taiwan Semiconductor's Phoenix plant likely three times larger than originally announced". Phoenix Business Journal. Archived from the original on 14 May 2021. Retrieved 1 May 2021.
54. ^ Blanchard, Ben (12 July 2021). "Taiwan finally getting BioNTech COVID vaccines in $350 mln deal". Reuters. Archived from the original on 12 July 2021. Retrieved 12 July 2021.
55. Blanchard, Ben (24 May 2021). "Pressure to accept China vaccines intensifies as Taiwan battles COVID surge". Reuters. Archived from the original on 12 July 2021. Retrieved 12 July 2021.
56. ^ Hille, Kathrin (11 July 2012). "TSMC and Foxconn join forces to secure vaccines for Taiwan". Financial Times. Archived from the original on 10 December 2022. Retrieved 12 July 2021.
57. Zhong, Raymond (16 June 2021). "Taiwan Wants German Vaccines. China May Be Standing in Its Way". The New York Times. Archived from the original on 12 July 2021. Retrieved 12 July 2021.
58. Chang, Eric (26 August 2021). "Taiwan's TSMC increases chip prices by up to 20% amid global shortage". Taiwan News. Archived from the original on 29 August 2021. Retrieved 29 August 2021.
59. "TSMC to Build Specialty Technology Fab in Japan with Sony Semiconductor Solutions as Minority Shareholder" (Press release). 9 November 2021. Archived from the original on 5 December 2021. Retrieved 9 November 2021.
60. "Sony to invest $500 mln in TSMC's new Japanese chip plant venture". Reuters. 9 November 2021. Archived from the original on 16 January 2023. Retrieved 9 November 2021.
61. ^ "Denso to take stake in TSMC venture – Taipei Times". www.taipeitimes.com. 16 February 2022. Archived from the original on 22 January 2023. Retrieved 22 January 2023.
62. ^ "DENSO to Take Minority Stake in JASM". TSMC. 15 February 2022. Retrieved 23 January 2023.
63. ^ "TSMC to Expand New Japan Chip Factory, Denso Takes Stake". U.S. News & World Report. 15 February 2022. Archived from the original on 22 January 2023. Retrieved 23 January 2023.
64. Kharpal, Arjun (14 July 2022). "World's largest chipmaker TSMC posts record profit allaying fears over semiconductor headwinds". CNBC. Archived from the original on 14 July 2022. Retrieved 14 July 2022.
65. Platt, Eric (15 November 2022). "Warren Buffett's Berkshire Hathaway buys $4bn stake in chipmaker TSMC". Financial Times. Archived from the original on 10 December 2022.
66. Mandl, Carolina; S, Sittarasu (14 February 2023). "Berkshire dumps shares in TSMC, banks; increases Apple stake". Reuters. Archived from the original on 16 February 2023. Retrieved 16 February 2023.
67. Stempel, Jonathan (11 April 2023). "Buffett says geopolitics a factor in Berkshire sale of TSMC stake". Reuters. Archived from the original on 12 April 2023. Retrieved 12 April 2023.
68. "TSMC shares hit record high after Morgan Stanley lifts client Nvidia's price target on AI chip demand". CNBC. 15 February 2024. Archived from the original on 23 February 2024. Retrieved 25 February 2024.
69. "Archived copy". Archived from the original on 3 June 2024. Retrieved 3 June 2024.{{cite web}}: CS1 maint: archived copy as title (link)
70. Chen, Eliot; Berman, Noah (31 October 2024). "TSMC's Huawei Headache". The Wire China. Retrieved 3 November 2024.
71. "TSMC notifies US about use of its chip by Huawei". Taipei Times. 24 October 2024. Retrieved 23 October 2024.
72. Alper, Alexandra (23 October 2024). "US lawmaker demands answers on TSMC chip in Huawei device". Reuters. Retrieved 23 October 2024.
73. "GLOBALFOUNDRIES Files Patent Infringement Lawsuits Against TSMC In the U.S. and Germany". GlobalFoundries. 26 August 2019. Archived from the original on 17 April 2021. Retrieved 17 April 2021.
74. "GLOBALFOUNDRIES v. TSMC et al Media Fact Sheet" (PDF). GlobalFoundries. 25 August 2019. Archived (PDF) from the original on 28 August 2019. Retrieved 28 August 2019.
75. "TSMC Will Vigorously Defend its Proprietary Technology in Response to GlobalFoundries Complaints". TSMC. 27 August 2017. Archived from the original on 27 August 2019. Retrieved 28 August 2019.
76. "TSMC Files Complaints Against GlobalFoundries in U.S., Germany and Singapore for Infringement of 25 Patents to Affirm its Technology Leadership and to Protect Its Customers and Consumers Worldwide". TSMC. 1 October 2019. Archived from the original on 2 October 2019. Retrieved 2 October 2019.
77. "TSMC and GLOBALFOUNDRIES Announce Resolution of Global Disputes Through Broad Global Patent Cross-License". TSMC. 29 October 2019. Archived from the original on 29 October 2019. Retrieved 29 October 2019.
78. "GLOBALFOUNDRIES and TSMC Announce Resolution of Global Disputes Through Broad Global Patent Cross-License". GlobalFoundries. 28 October 2019. Archived from the original on 22 January 2021. Retrieved 30 October 2019.
79. McGregor, Jim (11 September 2019). "Globalfoundries Files Suit Against TSMC – The Outcome Could Have Broad Consequences". Forbes. Archived from the original on 19 December 2019. Retrieved 19 December 2019.
80. "TSMC counter-sues US chip rival GlobalFoundries for patent infringement". Reuters. 1 October 2019. Archived from the original on 19 December 2019. Retrieved 19 December 2019.
81. Kwan, Campbell (2 October 2019). "TSMC accuses GlobalFoundries of infringing 25 patents for node processes". ZDNet. Archived from the original on 9 March 2020. Retrieved 4 April 2020.
82. ^ Lee, Jane. "TSMC's New Chairman Affirms Hopes of AI-Fueled 2024 Recovery". Bloomberg.
83. "TSMC Income Statement". WSJ. Retrieved 2 August 2024.
84. "TSMC Income Statement (2014-2018) - WSJ". 11 January 2020. Archived from the original on 11 January 2020. Retrieved 2 August 2024.
85. "TSMC Income Statement (2019-2023) - WSJ". 4 April 2024. Archived from the original on 4 April 2024. Retrieved 2 August 2024.
86. "Taiwan Semiconductor Manufacturing: Number of Employees yearly". www.macrotrends.net. Retrieved 3 August 2024.
87. "Mobile chips are driving strong demand for TSMC's manufacturing services". Morningstar. 9 May 2014. Archived from the original on 28 April 2015. Retrieved 18 May 2014.
88. ^ "Smartphones, 28nm Tech Drive TSMC 1Q Revenue". EE Times. 17 April 2014. Archived from the original on 23 May 2014. Retrieved 23 May 2014.
89. ^ "Qualcomm pending to add SMIC to 28nm vendor list". SimmTester.com. 14 March 2014. Archived from the original on 22 May 2014. Retrieved 18 May 2014.
90. "Qualcomm Snapdragon 800 Processor First to Use TSMC's 28HPM Advanced Process Technology". TSMC. 25 February 2013. Retrieved 18 May 2014.
91. ^ Wang, Lisa (6 June 2013). "TSMC banking on 28nm shipments". Taipei Times. Archived from the original on 22 May 2014. Retrieved 18 May 2014.
92. ^ Josephine, Lien; Shen, Steve (6 May 2014). "MediaTek adding more 28nm chip orders at TSMC, UMC due to production defects at Globalfoundries". DigiTimes. Archived from the original on 20 August 2020. Retrieved 18 May 2014.
93. "TSMC Updates 1Q'14 Guidance". TSMC. 12 March 2014. Archived from the original on 17 April 2021. Retrieved 18 May 2014.
94. "TSMC Reports Second Quarter EPS of NT$2.30". TSMC. 16 July 2014. Archived from the original on 17 April 2021. Retrieved 16 August 2014.
95. Cage, Chao; Shen, Steve (9 May 2014). "TSMC extends 28 nm production lead time to 16 weeks". DigiTimes. Archived from the original on 12 May 2014. Retrieved 17 May 2014.
96. Cage, Chao; Shen, Steve (14 August 2014). "TSMC 4Q14 production capacity almost fully booked". DigiTimes. Archived from the original on 18 August 2014. Retrieved 16 August 2014.
97. ^ Wang, Lisa (11 December 2014). "TSMC revenue shrinks as clients adjust inventories". Taipei Times. Archived from the original on 6 January 2015. Retrieved 6 January 2015.
98. "Taiwan Semiconductor Manufacturing Company Limited Insider Trading & Ownership Structure". Simply Wall St. Archived from the original on 8 March 2024. Retrieved 8 March 2024.
99. Halfacree, Gareth (8 October 2019). "TSMC's EUV N7+ node hits volume production". bit-tech. Archived from the original on 9 July 2020. Retrieved 9 July 2020.
100. Shilov, Anton. "TSMC: N7+ EUV Process Technology in High Volume, 6nm (N6) Coming Soon". AnandTech. Archived from the original on 8 August 2020. Retrieved 9 July 2020.
101. October 2019, Arne Verheyde 07 (7 October 2019). "TSMC Starts Shipping EUV N7+ Chips, AMD Among Likely Customers". Tom's Hardware. Retrieved 9 July 2020.{{cite web}}: CS1 maint: numeric names: authors list (link)
102. "TSMC Technology Roadmap". community.cadence.com. 26 April 2019. Archived from the original on 11 July 2020. Retrieved 9 July 2020.
103. Zafar, Ramish (23 October 2019). "TSMC's N7+ EUV Yield Dropped Below 70% Claims Report". Wccftech. Archived from the original on 10 July 2020. Retrieved 9 July 2020.
104. Hamilton, Eric (8 October 2019). "TSMC enters high volume production with N7+ EUV process". TechSpot. Archived from the original on 9 July 2020. Retrieved 9 July 2020.
105. "40nm Technology". TSMC. Archived from the original on 4 April 2019. Retrieved 21 April 2019.
106. Nenni, Daniel (4 November 2015). "TSMC Unleashes Aggressive 28nm Strategy!". SemiWiki.com. Archived from the original on 24 March 2017. Retrieved 16 January 2017.
107. "22nm Technology". TSMC. Archived from the original on 4 April 2019. Retrieved 21 April 2019.
108. "20nm Technology". TSMC. Archived from the original on 4 April 2019. Retrieved 21 April 2019.
109. "16nm Technology". TSMC. Archived from the original on 10 July 2019. Retrieved 21 April 2019.
110. "Report: TSMC to relabel process as 12nm". eeNews Analog. 29 November 2016. Archived from the original on 21 April 2019. Retrieved 21 April 2019.
111. "10nm Technology". TSMC. Archived from the original on 4 April 2019. Retrieved 21 April 2019.
112. "7nm Technology". TSMC. Archived from the original on 9 June 2019. Retrieved 21 April 2019.
113. ^ "TSMCUnveils 6-nanometer Process" (PDF). TSMC. 16 April 2019. Archived (PDF) from the original on 17 April 2019. Retrieved 16 April 2019.
114. "TSMC Kicks Off 3nm Production: A Long Node to Power Leading Chips". www.tomshardware.com. 30 December 2022. Archived from the original on 29 November 2023. Retrieved 5 December 2023.
115. "Advanced 12-inch Technology". TSMC. Archived from the original on 11 December 2016. Retrieved 16 January 2017.
116. Marc, Gurman (9 June 2020). "Apple Plans to Announce Move to Its Own Mac Chips at WWDC". Bloomberg L.P. Archived from the original on 20 June 2024. Retrieved 10 June 2020 – via Google News.
117. Strong, Matthew (8 July 2020). "Taiwan chip giant TSMC places world's largest wind power order with Ørsted". Taiwan News. Archived from the original on 10 July 2020. Retrieved 8 July 2020.
118. Ting-Fang, Cheng (2 July 2021). "Apple and Intel become first to adopt TSMC's latest chip tech". Nikkei Asia. Archived from the original on 23 July 2021. Retrieved 23 July 2021.
119. ^ Gallagher, Dan (15 May 2020). "What a Small Chip Fab Really Buys". The Wall Street Journal. ISSN 0099-9660. Archived from the original on 6 December 2020. Retrieved 27 November 2020.
120. Smith, Ryan (15 May 2020). "TSMC To Build 5nm Fab In Arizona, Set To Come Online In 2024". Archived from the original on 20 October 2020. Retrieved 18 October 2020.
121. Chang, Eric (24 December 2020). "Taiwan's TSMC begins hiring push for $12 billion Arizona facility". Taiwan News. Archived from the original on 28 January 2021. Retrieved 27 February 2021.
122. "iPhone chip-maker TSMC invests $40bn in Arizona plants". BBC News. 7 December 2022. Retrieved 7 December 2022.
123. Jie, Yang (5 December 2022). "TSMC's Arizona Chip Plant, Awaiting Biden Visit, Faces Birthing Pains – Taiwanese company cites high costs and shortage of skilled personnel as it pushes to open $12 billion factory next year". Wall Street Journal. Archived from the original on 3 March 2023. Retrieved 4 March 2023. Mr. Chang said the cost of making chips in Arizona may be at least 50% higher than in Taiwan.
124. Smith, Noah (7 February 2023). "The Build-Nothing Country – Stasis has become America's spoils system, and it can't go on". Archived from the original on 3 March 2023. Retrieved 4 March 2023. Even in semiconductors, the ultra-high-tech industry where the U.S. and its allies must maintain leadership in order to maintain their edge over China, the U.S. can't seem to build much. TSMC, the Taiwanese company that recently agreed to build a big plant in Arizona, is running into major cost issues:
125. @kevinsxu (14 January 2023). "We're not able to share with you a specific cost gap number between Taiwan and US, but we can share with you that the major reason for the cost gap is the construction cost of building and facilities, which can be 4 to 5x greater for US fab versus a fab in Taiwan" (Tweet). Retrieved 2 March 2023 – via Twitter.
126. Belanger, Ashley (20 July 2023). "TSMC delays US chip fab opening, says US talent is insufficient". Ars Technica. Archived from the original on 21 July 2023. Retrieved 21 July 2023.
127. Lovejoy, Ben (11 September 2023). "TSMC Arizona chip plant will be a paperweight, says analyst". 9to5Mac. Archived from the original on 14 September 2023. Retrieved 14 September 2023.
128. Belanger, Ashley (18 January 2024). "TSMC predicts delays, less advanced chips at second Arizona fab". Ars Technica. Archived from the original on 19 January 2024. Retrieved 19 January 2024.
129. Park, Kate (8 April 2024). "US to award TSMC $6.6B in grants, $5B in loans to step up chip manufacturing in Arizona". TechCrunch. Archived from the original on 8 April 2024. Retrieved 8 April 2024.
130. "UPDATE 1-TSMC says plans $9.4 bln Taiwan plant". Reuters. 16 July 2010. Archived from the original on 17 December 2019. Retrieved 16 July 2010.
131. Clendenin, Mike (21 July 2010). "Analyst Warns Of Semiconductor Monopoly". InformationWeek. Archived from the original on 17 April 2021. Retrieved 17 April 2021.
132. "TSMC increases 28 nm output". fudzilla. 7 December 2012. Archived from the original on 22 May 2014. Retrieved 19 May 2014.
133. "TSMC Acquires PSC Land for New Fab Construction". Taiwan Economic News. 13 January 2011. Archived from the original on 24 July 2011. Retrieved 13 January 2011.
134. "WaferTech site subject of speculation". The Columbian. Archived from the original on 16 July 2021. Retrieved 16 July 2021.
135. "Technology". tsmcwashington.com. Archived from the original on 28 January 2024. Retrieved 28 January 2024.
136. "Company News – Chip maker is buying out three WaferTech partners". The New York Times. Bloomberg. 15 December 2000. Archived from the original on 17 April 2021. Retrieved 17 April 2021.
137. "WaferTech promotes Kuo to president, fab director". The Columbian. Archived from the original on 17 December 2021. Retrieved 17 December 2021.
138. "Taiwan's TSMC to build semiconductor factory in Germany". Archived from the original on 9 August 2023. Retrieved 9 August 2023.
139. "TSMC approves joint venture to build plant in Dresden, Germany". Archived from the original on 9 August 2023. Retrieved 9 August 2023.
140. "Germany spends big to win $11 billion TSMC chip plant". Archived from the original on 9 August 2023. Retrieved 9 August 2023.
141. "TSMC, Bosch, Infineon, and NXP Establish Joint Venture to Bring Advanced Semiconductor Manufacturing to Europe". Archived from the original on 27 November 2023. Retrieved 11 August 2023.
142. Lisa, Morgan (17 October 2024). "TSMC Q3 Results Exceed Expectations, Fueled by AI Demand". Hataf News. Archived from the original on 18 October 2024. Retrieved 18 October 2024.

External links

• Official website
• Business data for TSMC:
  • Bloomberg
  • Google
  • Reuters
  • SEC filings
  • Yahoo!

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